Solderability testing device type LPL

The device is used to determine the solderability of electrical components according to DIN EN 60068-2-20. It is equipped with 2 solder baths. . It has a lifting device that allows a defined immersion and withdrawal of specimens at immersion speeds from 0 to 45 mm/s. The lifting device has a max. travel of approximately 25 mm. The immersion time is controlled by the device software. The immersion speed and the dwell time in the solder bath are set and controlled by the software. The temperature in each of the two solder baths can be adjusted via a PID- temperature controller in the range from room temperature to 450 °C. The device is provided with an enclosure, the door of which is equipped with a safety hinge switch.

Applicable Standards
  • IEC 60068-2-20

    Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

We value your privacy. TEKEN44 uses cookies and collects personal data to connect manufacturers, labs, publishers, and clients, improve your experience, and comply with legal requirements. By clicking "Accept", you agree to our Privacy Policy and Terms of Use.