Solderability testing device type LPK
View Dr.-Ing. Georg Wazau Mess- + Prüfsysteme GmbH on TEKEN44The device tests the solderability of metals under DIN EN 60068-2-20. The device has a lifting unit which allows a defined submerging and emerging of specimen with submerging speeds from 0,5 to 1001 mm/s. The lifting unit has a maximal lifting height of 25 mm. The device is works with a quartz controlled submerging duration of 0 to 10 s. The solder bath is of type ZW 104 TE. The bath has a capacity of 3700 g or approx.400 ml. The dipping speed and the dwell time in the solder bath are set and controlled via the software. The temperature in the solder bath can be adjusted via a PID temperature controller in the range from room temperature to 450 °C. The unit is provided with an enclosure, the door of which is equipped with a safety switching hinge.
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Solderability testing device type LPL – Wazau
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